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Hycool_IT fifth general assembly in Brussels

Hycool_IT consortium met in Brussels📍 at FARI premises for its 5th General Assembly on the 5th and 6th May. The meeting on the first day focused on on refining requirements and methodology by addressing feedback from the initial review meeting, covering technical discussions on standardization, upcoming deliverables, and a publication plan. Also discussions concentrate on the ICT ecosystem and software orchestration, presenting project objectives, progress made, and challenges encountered, followed by deep-dive technical updates on the BDT Environment architecture (IDP) and SMTS/SIL-based MPC algorithms (IDP/IMP), each allocated 40 minutes, before concluding with next steps and future deliverables

During the second day we talked about implementation and validation and dissemination strategies. This session focussed on renovating the servers’ room and cooling systems for the HYCOOL-IT Project. The primary goal is to present and define a concrete Execution Plan covering both software and hardware requirements. The consortium also debated about:

  • DTwin as PaaS: A review of the current status and next steps for the Data Twin platform, specifically regarding Data, Models, and Software.
  • Hardware Requirements: An analysis of necessary hardware components, taking into account the current situation at the Demo Site in Milan.
  • Stakeholder Alignment: Definition of roles and responsibilities for all relevant stakeholders involved in the implementation. Taking into account all the links with umbrella organizations, sister projects and available clusters (2cool2waste, Smart Energy Cluster).

The consortium also discussed about the Final Event. This strategic planning session is scheduled for November (not date assigned yet) to conclude with the final day of the last General Assembly and will serve as a time to showcase the results and achievements from the project.

Hycool IT project has received funding from the European Union’s Horizon Europe programme under Grant Agreement No. 101138623.